LGA QCC730 Module
• Powered by Qualcomm game changing micro walt ultra-low power Wi-Fi technology, MQM730 IoT connectivity LGA module portfolio is purposely-designed to pack processing capabilities, embedded memory, Wi-Fi connectivity, on-module flash, and most of all ultra-low power technology into a single 36-pin LGA form factor with flexible choices of Pin, PCB and RF Connector Antenna+.
• All variant antenna modules are pin compatible, allowing easy swap among modules.
• Its 1.27mm (0.05”) pitch design enables seamless LGA pad into standard 1.27mm (0.05”) header conversion to allow field replaceable header module portfolio if needed. Its compact size and on-chip SRAM and RRAM (NVM) contribute to reduced costs and enhanced performance, making it an attractive choice for space-constrained IoT devices requiring battery power.
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• All variant antenna modules are pin compatible, allowing easy swap among modules.
• Its 1.27mm (0.05”) pitch design enables seamless LGA pad into standard 1.27mm (0.05”) header conversion to allow field replaceable header module portfolio if needed. Its compact size and on-chip SRAM and RRAM (NVM) contribute to reduced costs and enhanced performance, making it an attractive choice for space-constrained IoT devices requiring battery power.
Product Specifications
